Three-Dimensional Integration and Modeling : A Revolution in RF and Wireless Packaging

Jong-Hoon Lee

ISBN : 9781598294736
Publisher : Morgan & Claypool Publishers
Publication Year : 2008
Imprint : Morgan & Claypool
CD Included : No
Pages : 108
Binding : Hardback

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This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization.

Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules.

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